光刻胶


5822yh银河国际具备极强的自主创新研发能力,针对IC封装开发出KX5*系列、KX1*系列、KX4*系列光刻胶,以适应各种高科技制造客户的不同需求。


Product ModelThickness(μm)CD(μm)CharacteristicApplication

KX5*系列

0.8-2

≥0.35(@1μm)

High resolution, low energy

High anti-etching ratio, Profile≥ 85 °

IC,Etch

KX1*系列

5-25

≥8(@15μm)

High thickness, electroplating resistant

Profile≥ 85°

Advanced packaging,

 RDL

KX4*系列

3-10

≥5(@5μm)

Negative CA photoresist, low energy Su-bseries for lift off

Lift off